Key facts
- This page summarizes Fonon Technologies, Inc.'s Form 3/A filing for Laser Photonics Corp (LASE).
- 0 reported transactions and 0 derivative rows are listed below.
- Accepted by SEC: 09 Aug 2024, 11:34.
Fonon Technologies, Inc. - 16 Oct 2023 Form 3/A Insider Report for Laser Photonics Corp (LASE)
- Reporting relationship
- Affiliate
- Issuer ticker
- LASE
- Reported as of
- 16 Oct 2023
- Net transaction value
- $0
- SEC form
- 3/A
- Accepted by SEC
- 09 Aug 2024, 11:34:54 UTC
- Original report date
- 14 May 2024
- Source filing
- View source filing
- Reporting owner signature
- /s/ Dmitriy Nikitin, President
Source evidence
Original filing metadata and source links for verification.
4 source fields
Reporting owner
1 detail
Key filing fact
Fonon Technologies, Inc. filed Form 3/A for Laser Photonics Corp (LASE) on 09 Aug 2024.
Change
- No earlier filing in this sequence is available for direct comparison.
- Current net transaction value: $0.
Research use
- This tells you what this filing adds before you inspect full transaction and derivative tables.
- You can trace every row back to the original SEC filing document.
Evidence
Official SEC source
View source filing
Ownership activity is grounded in SEC Form 3/A disclosures.
Reported non-derivative transactions
Shares, units, or other non-derivative securities reported in this filing.
LASE
holding
Common Stock, par value $.001per share
No transaction description listed
- Transaction value
- Shares
- Change %
- Price
- Shares after
- 1,000,000
- Date
- 16 Oct 2023
- Ownership
- Direct
- Footnotes
- F1
* marks a reported price that did not pass the local price check.
Additional SEC filing notes
Filing notes and footnotes
Explanation of responses 1 footnote
Footnote F1
Fonon Technologies, Inc. ("FTI") is controlled by ICT Investments, LLC, that is controlled by Dmitriy Nikitin of which he is Managing Partner. ICT Investments, LLC also controls Laser Photonics Corporation ("Laser Photonics"). FTI received 1,000,000 restricted shares of Laser Photonics common stock under the terms of a License Agreement between Laser Photonics and FTI for an exclusive, worldwide, sub-licensable right of Laser Photonics to FTI's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.