Key facts
- This page summarizes ICT Investments LLC's Form 4/A filing for Laser Photonics Corp (LASE).
- 1 reported transaction and 0 derivative rows are listed below.
- Accepted by SEC: 17 Jul 2024, 14:39.
ICT Investments LLC - 21 May 2024 Form 4/A Insider Report for Laser Photonics Corp (LASE)
- Reporting relationship
- Owner of 68% of Issuer
- Issuer ticker
- LASE
- Reported as of
- 21 May 2024
- Net transaction value
- +$6,630,000
- SEC form
- 4/A
- Accepted by SEC
- 17 Jul 2024, 14:39:02 UTC
- Original report date
- 11 Jul 2024
- Prior SEC filing
- 09 Aug 2024
- Source filing
- View source filing
- Reporting owner signature
- /s/ Dmitriy Nikitin, Managing Partner
Source evidence
Original filing metadata and source links for verification.
5 source fields
Reporting owner
1 detail
Key filing fact
ICT Investments LLC filed Form 4/A for Laser Photonics Corp (LASE) on 17 Jul 2024.
Change
- Previous filing in this sequence was filed on 09 Aug 2024.
- Current net transaction value: +$6,630,000.
Research use
- This tells you what this filing adds before you inspect full transaction and derivative tables.
- You can trace every row back to the original SEC filing document.
Evidence
Filed on Form 4
View source filing
Ownership activity is grounded in SEC Form 4/A disclosures.
Reported non-derivative transactions
Shares, units, or other non-derivative securities reported in this filing.
LASE
transaction
Common Stock
Award
- Transaction value
- $6,630,000
- Shares
- +3,000,000
- Change %
- +55%
- Price
- $2.21
- Shares after
- 8,438,695
- Date
- 21 May 2024
- Ownership
- See note below
- Footnotes
- F1
* marks a reported price that did not pass the local price check.
Additional SEC filing notes
Filing notes and footnotes
Explanation of responses 1 footnote
Footnote F1
ICT Investments, LLC owns the majority of the shares of Fonon Corporation ("Fonon") that received 3,000,000 restricted shares of Laser Photonics Corporation ("Laser Photonics") common stock as disclosed by Fonon in its Form 4 filed on July 11, 2024, under the terms of a License Agreement between Laser Photonics, an affiliate of ICT Investments, and Fonon for an exclusive, worldwide, sub-licensable right of Laser Photonics to Fonon's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.