Fonon Technologies, Inc. - 16 Oct 2023 Form 3/A Insider Report for Laser Photonics Corp (LASE)

Role: Affiliate
Signature: /s/ Dmitriy Nikitin, President
Issuer symbol: LASE
Transactions as of: 16 Oct 2023
Net transactions value: $0
Form type: 3/A
Filing time: 09 Aug 2024, 11:34:54 UTC
Date Of Original Report: 14 May 2024
SEC: View on sec.gov

Transactions Table

Type	Sym	Class	Transaction	Value $	Shares	Change %	* Price $	Shares After	Date	Ownership	Footnotes
holding	LASE	Common Stock, par value $.001per share						1,000,000	16 Oct 2023	Direct	F1

* An asterisk sign (*) next to the price indicates that the price is likely invalid.

Explanation of Responses:

Id	Content
F1	Fonon Technologies, Inc. ("FTI") is controlled by ICT Investments, LLC, that is controlled by Dmitriy Nikitin of which he is Managing Partner. ICT Investments, LLC also controls Laser Photonics Corporation ("Laser Photonics"). FTI received 1,000,000 restricted shares of Laser Photonics common stock under the terms of a License Agreement between Laser Photonics and FTI for an exclusive, worldwide, sub-licensable right of Laser Photonics to FTI's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.

Content

Fonon Technologies, Inc. ("FTI") is controlled by ICT Investments, LLC, that is controlled by Dmitriy Nikitin of which he is Managing Partner. ICT Investments, LLC also controls Laser Photonics Corporation ("Laser Photonics"). FTI received 1,000,000 restricted shares of Laser Photonics common stock under the terms of a License Agreement between Laser Photonics and FTI for an exclusive, worldwide, sub-licensable right of Laser Photonics to FTI's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.