ICT Investments LLC - 21 May 2024 Form 4/A Insider Report for Laser Photonics Corp (LASE)

Role: Owner of 68% of Issuer
Signature: /s/ Dmitriy Nikitin, Managing Partner
Issuer symbol: LASE
Transactions as of: 21 May 2024
Net transactions value: +$6,630,000
Form type: 4/A
Filing time: 17 Jul 2024, 14:39:02 UTC
Date Of Original Report: 11 Jul 2024
Previous filing: 09 Aug 2024
SEC: View on sec.gov

Transactions Table

Type	Sym	Class	Transaction	Value $	Shares	Change %	* Price $	Shares After	Date	Ownership	Footnotes
transaction	LASE	Common Stock	Award	$6,630,000	+3,000,000	+55%	$2.21	8,438,695	21 May 2024	See note below	F1

* An asterisk sign (*) next to the price indicates that the price is likely invalid.

Explanation of Responses:

Id	Content
F1	ICT Investments, LLC owns the majority of the shares of Fonon Corporation ("Fonon") that received 3,000,000 restricted shares of Laser Photonics Corporation ("Laser Photonics") common stock as disclosed by Fonon in its Form 4 filed on July 11, 2024, under the terms of a License Agreement between Laser Photonics, an affiliate of ICT Investments, and Fonon for an exclusive, worldwide, sub-licensable right of Laser Photonics to Fonon's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.

Content

ICT Investments, LLC owns the majority of the shares of Fonon Corporation ("Fonon") that received 3,000,000 restricted shares of Laser Photonics Corporation ("Laser Photonics") common stock as disclosed by Fonon in its Form 4 filed on July 11, 2024, under the terms of a License Agreement between Laser Photonics, an affiliate of ICT Investments, and Fonon for an exclusive, worldwide, sub-licensable right of Laser Photonics to Fonon's laser material processing equipment and technology, including all applications of laser cutting, marking, engraving, laser welding, brazing, ablation, laser drilling, semiconductor chip marking, semiconductor and FPD (flat panel display) laser processing equipment, all other laser material processing equipment documented or existing in a form of knowhow and/or trade secrets.