Yung-Pei Chin - 18 Mar 2026 Form 3 Insider Report for TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM)

Role
EVP and Co-COO
Signature
/s/ Jen-Chau Huang, as attorney-in-fact
Issuer symbol
TSM
Transactions as of
18 Mar 2026
Net transactions value
$0
Form type
3
Filing time
18 Mar 2026, 06:10:30 UTC
SEC
View on sec.gov

Reporting Owners (1)

Name Relationship Address Signature Signature date CIK
Chin Yung-Pei EVP and Co-COO NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN /s/ Jen-Chau Huang, as attorney-in-fact 18 Mar 2026 0002117998

Transactions Table

Type Sym Class Transaction Value $ Shares Change % * Price $ Shares After Date Ownership Footnotes
holding TSM Common Shares (2330.TW) 5,171,935 18 Mar 2026 Direct
holding TSM Common Shares (2330.TW) 8,059 18 Mar 2026 By ESPP Trust F1
holding TSM Common Shares (2330.TW) 63,345 18 Mar 2026 By LTI Trust F2
holding TSM Common Shares (2330.TW) 4,190,107 18 Mar 2026 By Spouse
* An asterisk sign (*) next to the price indicates that the price is likely invalid.

Explanation of Responses:

Id Content
F1 Common Shares purchased and held under the issuer's Employee Stock Purchase Plan ("ESPP").
F2 Represents Common Shares purchased by a trust with cash received under the issuer's Long-Term Incentive ("LTI") Bonus Plan, over which the filer has obtained investment control.

Remarks:

Exhibit 24 - Power of Attorney